Application of Chemical-Mechanical Polishing to Planarization of Surface-Micromachined Devices

R.D. Nasby, J.J. Sniegowski, James H. Smith, Stephen Montague, C.C. Barron, William P. Eaton, Dale L. Hetherington, Christopher A. Apblett, J. G. Fleming, P. J. McWhorter

1996 · 57 citations · 13 references

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Abstract

We discuss the CMP process and present examples of the use of CMP in fabricating MEMS devices such as microengines, pressure sensors, and proof masses for accelerometers along with its use for monolithically integrating MEMS devices with microelectronics.

References

13