Mass production techniques for optical modules

Abstract

This paper describes optical packaging techniques to realize mass production. A novel passive alignment technique is developed as a key technique for module assembly. A laser diode (LD) is passively positioned on a Si substrate by detecting a pair of alignment marks located on the LD and Si substrate. A single-mode fiber is self aligned on a Si V-groove. A simple receptacle structure for the module output port is also designed. This structure has realized both automatic module assembly and automatic module mount on a circuit board, for the first time. In addition to packaging techniques, advanced module applications such as a surface mount LD module and a hybrid integrated waveguide module, are introduced.