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New qualified industrial AlGaN/GaN HEMT process: Power performances & reliability figures of merit
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2012
Year
EngineeringEnergy EfficiencyIndustrial EngineeringPower Electronic SystemsPower ElectronicsPower PerformancesRf SemiconductorPower SemiconductorsPower Electronic DevicesElectrical EngineeringNew Power 0.5Aluminum Gallium NitridePower Semiconductor DeviceReliability FiguresCategoryiii-v SemiconductorMicroelectronicsElementary Power TransistorsPower DeviceGan Power DeviceTechnology
This paper describes the performances of a new power 0.5 µm gate length AlGaN / GaN HEMT process named GH50_10. This process has been developed to address applications and market needs up to 7 GHz. A specific emphasis has been attached to find a trade- off in between power / efficiency and linearity. After an introduction of the context, a short description of the process manufacturing is given including spread of the DC parameters. From the qualification procedure, key reliability figures of the process are presented like the main energy of activation and an evaluation of the Median Time to Failure, evaluated respectively to 1.95ev and 106 hours at 200°C. Power performances are presented from L to C bands from 15W for the elementary power transistors to 50W for high power packaged transistors. This technology is presently available at industrial level to address products requirements for telecom and military needs. Compliance to space requirement is underway
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