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A 65 nm-node CMOS technology with highly reliable triple gate oxide suitable for power-considered system-on-a-chip
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2004
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Low-power ElectronicsElectrical EngineeringEngineeringVlsi DesignNm-node Cmos TechnologyCircuit SystemNanoelectronicsBias Temperature InstabilityPower Semiconductor DeviceComputer EngineeringCmos TechnologyPower ElectronicsMicroelectronicsPower-considered System-on-a-chipActive Power ReductionsLow Damage Process
We have developed 65 nm-node CMOS technology for general-purpose system-on-a-chip (SoC), in which both standby and active power reductions are strongly required. With highly reliable triple gate oxide (1.3 nm, 1.6 nm and 3.2 nm) using low damage process, an average standby current can be reduced to one-fifth compared with conventional case. Gate pre-doping and RTA conditions were optimized to maintain on-current even with the supply voltage of 0.9 V. High-speed (HS) transistors show on-current of 680 /spl mu/A//spl mu/m for nFET and 240 /spl mu/A//spl mu/m for pFET with I/sub G/ of 13 nA//spl mu/m and I/sub OFF/ of 30 nA//spl mu/m. Low-gate-leakage (LGL) transistors show on-current of 490 /spl mu/A//spl mu/m for nFET and 175 /spl mu/A//spl mu/m for pFET with I/sub G/ of 0.8 nA//spl mu/m and I/sub OFF/ of 3 nA//spl mu/m. Gate oxide of all the above transistors exhibit tight TDDB distributions.