2002 · 11 citations · 5 references
In this paper, the impact of conventional silicon technology parameters on the characteristics of passives is studied. For both inductors and capacitors, cost-effective modules, which integrate easily into wiring BEOL (back-end of line) in a conventional silicon technology and provide high Q factor components are presented. For an inductor of 3 nH, designed for 2 GHz frequency applications, and fabricated in thick Cu as an add-on module, Q factor of /spl sim/24 is reached. The metal insulator metal (MIM) capacitor module with outstanding RF performances and a Q factor ranging from 100-1000 in the few GHz frequency range is developed in the Al BEOL. Compact lumped element SPICE models for both components are proposed and verified.
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High Q inductor add-on module in thick Cu/SiLK/sup TM/ single damascene
S. Jenei, Stefaan Decoutere, Gillis Winderickx et al. · 2001 · 18 citations
Getting aggressive with passive devices
Richard K. Ulrich, W.D. Brown, Siaw-Wei Ang et al. · IEEE Circuits and Devices Magazine · 2000 · 14 citations
Engineering, Discrete Passive, Thin Film Process Technology +21