Concepedia

Microstructural evaluation and failure analysis of Ag wire bonded to Al pads

Miri Choi, Hyung Giun Kim, Taeg-Woo Lee, Young-Jun Jeon, Yong-Keun Ahn, K.M. Koo, You‐Cheol Jang, So‐Yeon Park, Jae-Hak Yee, Nam-Kwon Cho,

Microelectronics Reliability · 2015 · 18 citations · 34 references

DOI

Concepts

References

34

Behavior of aluminum oxide, intermetallics and voids in Cu–Al wire bonds

Huining Xu, C. Liu, Vadim V. Silberschmidt et al. · Acta Materialia · 2011 · 246 citations

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Microstructural evaluation of interfacial intermetallic compounds in Cu wire bonding with Al and Au pads

Hyung Giun Kim, Sang Min Kim, Jae Young Lee et al. · Acta Materialia · 2013 · 75 citations

, , +15

A micromechanism study of thermosonic gold wire bonding on aluminum pad

Huining Xu, C. Liu, Vadim V. Silberschmidt et al. · Journal of Applied Physics · 2010 · 71 citations · Full text

, , +17

Thermodynamic properties of coherent interfaces in f.c.c.-based Ag–Al alloys: a first-principles study

Mark Asta, J.J. Hoyt · Acta Materialia · 2000 · 60 citations

, , +17

Reliability study of low cost alternative Ag bonding wire with various bond pad materials

Kyung-Ah Yoo, Chul Uhm, Taejin Kwon et al. · 2009 · 55 citations

, , +16