Bonded Interface Failure

Bonded Interface Failure is a material-level degradation phenomenon characterized by the disruption of adhesion at the junction between a polymerizing resin and a substrate due to internally generated polymerization stress exceeding the interfacial bond strength.

98

Publications

3.2K

Citations

387

Authors

157

Institutions

Publications per year

2017–2026

39

Authors

387

  1. PQ
    Pizhong Qiao

    Washington State University, United States

    4 publications · 176 citations

    4

    h-index

  2. JF
    Julio F. Davalos

    West Virginia University, United States

    3 publications · 277 citations

    3

    h-index

  3. DA
    Dwayne Arola

    University of Maryland, Baltimore County, United States

    3 publications · 68 citations

    3

    h-index

  4. SG
    Shanshan Gao

    Sichuan University, China

    2 publications · 28 citations

    2

    h-index

  5. NV
    Nunziante Valoroso

    Parthenope University of Naples, Italy

    2 publications · 136 citations

    2

    h-index

1–5 of 387

Venues

  1. Composite Structures

    8 publications · 269 citations

    8

    h-index

  2. Construction and Building Materials

    5 publications · 271 citations

    5

    h-index

  3. Microelectronics Reliability

    5 publications · 114 citations

    5

    h-index

  4. Journal of Building Engineering

    4 publications · 112 citations

    4

    h-index

  5. Journal of Dentistry

    4 publications · 98 citations

    4

    h-index

1–5