Statistics
Publications
13
Citations
214
Authors
6
Location
Richmond, United States
13
Batch micropackaging by compression-bonded wafer-wafer transfer
Michel M. Maharbiz, Michael B. Cohn, Roger T. Howe et al. · 1999 · 28 citations
MEMS packaging on a budget (fiscal and thermal)
Michael B. Cohn, Ryan Roehnelt, Ji-Hai Xu et al. · 2003 · 20 citations
RF MEMS switches for Wide I/O data bus applications
Michael B. Cohn, Kaosio Saechao, Michael C. Whitlock et al. · 2013 · 10 citations
Engineering, Electrical Engineering, Microelectromechanical Systems +15
1–4 of 13
6
3
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3
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MicroAssembly Technologies (United States), United States
2 publications · 24 citations
2
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MicroAssembly Technologies (United States), United States
2 publications · 11 citations
1
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MicroAssembly Technologies (United States), United States
3 publications · 11 citations
1
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1–5 of 6