Statistics
Publications
49
Citations
1.3K
Authors
1
Location
Atlanta, United States
49
Modeling and Analysis of Through-Silicon Via (TSV) Noise Coupling and Suppression Using a Guard Ring
Jonghyun Cho, Eakhwan Song, Ki-Hyun Yoon et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2011 · 166 citations
Engineering, Computer Engineering, Electrical Engineering +17
Health monitoring algorithms for space application batteries
Freeman Rufus, Seungkoo Lee, Ash Thakker · 2008 · 47 citations
1–5 of 49
1
Global Technology Connection (United States), United States
14 publications · 183 citations
6
h-index
1–1 of 1