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ePack (United States)

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Publications

13

Citations

233

Authors

3

Location

Ann Arbor, United States

ePack (United States) is a company institution in Ann Arbor, United States known for education, sensors, and measurement.

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Publications

13

A Micro Oven-Control System for Inertial Sensors

Donguk Yang, Jong-Kwan Woo, Sangwoo Lee et al. · Journal of Microelectromechanical Systems · 2017 · 52 citations

, , +23

Wafer-level vacuum/hermetic packaging technologies for MEMS

Sang Hyun Lee, J. Mitchell, Warren C. Welch et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 2010 · 24 citations

±2ppm frequency drift and 300x reduction of bias drift of commercial 6-axis inertial measurement units using a low-power oven-control micro platform

Donguk Yang, Jong‐Kwan Woo, Khalil Najafi et al. · 2015 · 14 citations

, , +18

Output Drifting of Vacuum Packaged MEMS Sensors Due to Room Temperature Helium Exposure

D.R. Sparks, J. Mitchell, Sangwoo Lee · Journal of Sensor Technology · 2013 · 11 citations · Full text

Improved Scale-Factor and Bias Stability of Ovenized Inertial Sensors in an Environmentally-Stabilized Inertial Measurement Unit (eIMU)

David Lemmerhirt, Onnop Srivannavit, Sam Chen et al. · 2019 · 11 citations

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Authors

3

  1. SL
    Sangwoo Lee

    ePack (United States), United States

    23 publications · 196 citations

    7

    h-index

  2. DC
    Dorian Challoner

    ePack (United States), United States

    5 publications · 23 citations

    3

    h-index

  3. MN
    M. Nayeli Trevino

    ePack (United States), United States

    1 publications · 11 citations

    1

    h-index

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