Concepedia

Packaging Damage Detection

Packaging Damage Detection is a systematic method within the field of quality assurance that identifies physical deformities, structural breaches, or surface anomalies in packaging materials through visual, sensor-based, or algorithmic analysis to ensure product integrity and compliance with safety standards.

13

Publications

365

Citations

42

Authors

16

Institutions

Publications per year

2017–2026

1

Parents

Publications

13

Damage characteristics produced by insect pests in packaging film

Jordi Riudavets, Inés Arnao Salas, María José Pons · Journal of Stored Products Research · 2007 · 122 citations

, , +16

Verifiable Smart Packaging with Passive RFID

Ge Wang, Jinsong Han, Chen Qian et al. · IEEE Transactions on Mobile Computing · 2018 · 39 citations

, , +16

Automated defect recognition of C-SAM images in IC packaging using Support Vector Machines

Yujuan Zhang, Ning Guo, Hejun Du et al. · The International Journal of Advanced Manufacturing Technology · 2004 · 34 citations

, , +17

Material identification of loose particles in sealed electronic devices using PCA and SVM

Guofu Zhai, Jinbao Chen, Shujuan Wang et al. · Neurocomputing · 2014 · 31 citations

, , +16

Non-destructive identification of defects in integrated circuit packages by scanning acoustic microscopy

Jicheng Yang · Microelectronics Reliability · 1996 · 23 citations

, , +15

1–5 of 13

Authors

42

  1. JZ
    Jizhong Zhao

    Xi'an Jiaotong University, China

    2 publications · 59 citations

    2

    h-index

  2. GW
    Ge Wang

    Xi'an Jiaotong University, China

    2 publications · 59 citations

    2

    h-index

  3. JH
    Jinsong Han

    Xi'an Jiaotong University, China

    2 publications · 59 citations

    2

    h-index

  4. CQ
    Chen Qian

    University of California, Santa Cruz, United States

    2 publications · 59 citations

    2

    h-index

  5. WX
    Wei Xi

    Xi'an Jiaotong University, China

    2 publications · 59 citations

    2

    h-index

1–5 of 42

Institutions

16

  1. Xi'an Jiaotong University

    Xi'an, China

    2 h-index

    10 publications

    276 citations

  2. University of California, Santa Cruz

    Santa Cruz, United States

    2 h-index

    2 publications

    59 citations

  3. Queen's University Belfast

    Belfast, United Kingdom

    1 h-index

    2 publications

    62 citations

  4. Xidian University

    Xi'an, China

    1 h-index

    1 publications

    39 citations

  5. Nottingham Trent University

    Nottingham, United Kingdom

    1 h-index

    4 publications

    44 citations

  6. Zhejiang University

    Hangzhou, China

    1 h-index

    1 publications

    39 citations

  7. IBM Research - Thomas J. Watson Research Center

    Yorktown Heights, United States

    1 h-index

    3 publications

    36 citations

  8. National Institute of Advanced Industrial Science and Technology

    Tsukuba, Japan

    1 h-index

    3 publications

    39 citations

1–8 of 16

Venues

  1. Microelectronics Reliability

    2 publications · 33 citations

    2

    h-index

  2. 1

    h-index

  3. Machine Vision and Applications

    1 publications · 12 citations

    1

    h-index

  4. Journal of Materials Processing Technology

    1 publications · 11 citations

    1

    h-index

  5. Journal of Materials Science

    1 publications · 13 citations

    1

    h-index

1–5