Packaging Damage Analysis
Packaging Damage Analysis is a forensic methodology within packaging science that systematically identifies, characterizes, and interprets physical, chemical, or structural anomalies in packaging materials to determine the cause, origin, and mode of damage incurred during production, distribution, or storage.
27
Publications
811
Citations
80
Authors
34
Institutions
Publications per year
2017–2026
3
Parents
27
Pradeep Lall, Dhananjay Panchagade, Prakriti Choudhary et al. · IEEE Transactions on Components and Packaging Technologies · 2008 · 69 citations
Engineering, Electrical Engineering, Mechanical Behavior Of Materials +16
1–5 of 27
80
4
h-index
3
h-index
3
h-index
3 publications · 54 citations
3
h-index
2
h-index
1–5 of 80
34

Jinan University
Guangzhou, China
3 h-index
4 publications
75 citations

Zhejiang University
Hangzhou, China
2 h-index
10 publications
343 citations
Hubei University of Technology
Wuhan, China
2 h-index
2 publications
44 citations
Auburn University
Auburn, United States
2 h-index
8 publications
622 citations
Jiangnan University
Wuxi, China
2 h-index
2 publications
45 citations

University of Surrey
Guildford, United Kingdom
1 h-index
1 publications
15 citations
Weihenstephan-Triesdorf University of Applied Sciences
Freising, Germany
1 h-index
3 publications
75 citations
Samsung (South Korea)
Seoul, South Korea
1 h-index
1 publications
26 citations
1–8 of 34
8 publications · 165 citations
8
h-index
3 publications · 54 citations
3
h-index
Repository · 1 publications · 38 citations
1
h-index
1 publications · 24 citations
1
h-index
JTE · 1 publications · 16 citations
1
h-index
1–5