Concepedia

Multilayer Substrate Design

Multilayer Substrate Design is a methodological framework in microwave packaging that integrates multiple dielectric and conductive layers to optimize electromagnetic performance, thermal management, and mechanical reliability through controlled interlayer material selection and vertical interconnect architecture.

50

Publications

1.6K

Citations

200

Authors

60

Institutions

Publications per year

2017–2026

17

Parents

Publications

50

Multibeam SIW Slotted Waveguide Antenna System Fed by a Compact Dual-Layer Rotman Lens

Karim Tekkouk, Mauro Ettorre, Laurent Le Coq et al. · IEEE Transactions on Antennas and Propagation · 2015 · 137 citations

, , +16

A multilayer coated fiber-based substrate suitable for printed functionality

Roger Bollström, Anni Määttänen, Daniel Tobjörk et al. · Organic Electronics · 2009 · 130 citations

, , +14

Multilayer Substrate Integrated Waveguide (SIW) Filters With Higher-Order Mode Suppression

Dinghong Jia, Quanyuan Feng, Qianyin Xiang et al. · IEEE Microwave and Wireless Components Letters · 2016 · 118 citations

, , +14

Substrate Integrated Waveguide-to-Microstrip Transition in Multilayer Substrate

Yan Ding, Ke Wu · IEEE Transactions on Microwave Theory and Techniques · 2007 · 85 citations

, , +16

Research of LTCC/Cu, Ag multilayer substrate in microelectronic packaging

Yonggang Wang, Guangneng Zhang, Jusheng Ma · Materials Science and Engineering B · 2002 · 74 citations

, , +14

1–5 of 50

Authors

200

  1. YS
    Yuzo Shimada

    NEC (Japan), Japan

    3 publications · 42 citations

    3

    h-index

  2. KS
    K.D. Scholz

    Hewlett-Packard (United States), United States

    2 publications · 41 citations

    2

    h-index

  3. SB
    Shaoyuan Bai

    Guilin University of Technology, China

    2 publications · 38 citations

    2

    h-index

  4. QX
    Qinglin Xie

    Guilin University of Technology, China

    2 publications · 38 citations

    2

    h-index

  5. MC
    M. Cobarruviaz

    Hewlett-Packard (United States), United States

    2 publications · 41 citations

    2

    h-index

1–5 of 200

Institutions

60

  1. NEC (Japan)

    Tokyo, Japan

    3 h-index

    11 publications

    158 citations

  2. Polytechnique Montréal

    Montreal, Canada

    3 h-index

    6 publications

    438 citations

  3. Guilin University of Technology

    Guilin, China

    2 h-index

    11 publications

    214 citations

  4. Hewlett-Packard (United States)

    Palo Alto, United States

    2 h-index

    10 publications

    205 citations

  5. Kyocera (Japan)

    Kyoto, Japan

    1 h-index

    5 publications

    105 citations

  6. Georgia Institute of Technology

    Atlanta, United States

    1 h-index

    2 publications

    26 citations

  7. Nottingham Trent University

    Nottingham, United Kingdom

    1 h-index

    1 publications

    24 citations

  8. Hellenic Mediterranean University

    Heraklion, Greece

    1 h-index

    7 publications

    105 citations

1–8 of 60

Venues

  1. IEEE Transactions on Advanced Packaging

    4 publications · 109 citations

    4

    h-index

  2. IEEE Microwave and Wireless Components Letters

    3 publications · 167 citations

    3

    h-index

  3. 3

    h-index

  4. 3

    h-index

  5. IEEE Transactions on Antennas and Propagation

    2 publications · 204 citations

    2

    h-index

1–5