Concepedia

Microwave Packaging Structures

Microwave Packaging Structures is a type of electromagnetic enclosure system designed to isolate, protect, and interconnect microwave passive components while minimizing signal loss, parasitic coupling, and environmental interference through optimized material composition, geometric configuration, and shielding integrity.

18

Publications

718

Citations

62

Authors

22

Institutions

Publications per year

2017–2026

5

Parents

Publications

18

Parallel Plate Cavity Mode Suppression in Microstrip Circuit Packages Using a Lid of Nails

Eva Rajo‐Iglesias, Ashraf Uz Zaman · IEEE Microwave and Wireless Components Letters · 2009 · 186 citations

, , +16

New Microstrip Gap Waveguide on Mushroom-Type EBG for Packaging of Microwave Components

Elena Pucci, Eva Rajo‐Iglesias · IEEE Microwave and Wireless Components Letters · 2012 · 116 citations

, , +16

Modeling of 3-D Vertical Interconnect Using Support Vector Machine Regression

Xia Lei, Jicheng Meng, Ruimin Xu et al. · IEEE Microwave and Wireless Components Letters · 2006 · 85 citations

, , +17

Bed of Springs for Packaging of Microstrip Circuits in the Microwave Frequency Range

Eva Rajo‐Iglesias, Per-Simon Kildal, Ashraf Uz Zaman et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2012 · 46 citations · Full text

, , +16

Suppression of Parallel Plate Modes in Low Frequency Microstrip Circuit Packages Using Lid of Printed Zigzag Wires

Eva Rajo‐Iglesias, Elena Pucci, Ahmed A. Kishk · IEEE Microwave and Wireless Components Letters · 2013 · 38 citations · Full text

, , +15

1–5 of 18

Authors

62

  1. ER
    Eva Rajo‐Iglesias

    Universidad Carlos III de Madrid, Spain

    4 publications · 386 citations

    4

    h-index

  2. TM
    Tamir Moran

    University of Arizona, United States

    2 publications · 44 citations

    2

    h-index

  3. KV
    K.L. Virga

    University of Arizona, United States

    2 publications · 44 citations

    2

    h-index

  4. EP
    Elena Pucci

    Chalmers University of Technology, Sweden

    2 publications · 154 citations

    2

    h-index

  5. DS
    Dongquan Sun

    Xidian University, China

    2 publications · 45 citations

    2

    h-index

1–5 of 62

Institutions

22

  1. Chalmers University of Technology

    Gothenburg, Sweden

    4 h-index

    6 publications

    478 citations

  2. Universidad Carlos III de Madrid

    Madrid, Spain

    4 h-index

    4 publications

    386 citations

  3. Xidian University

    Xi'an, China

    2 h-index

    14 publications

    315 citations

  4. Concordia University

    Montreal, Canada

    2 h-index

    2 publications

    84 citations

  5. University of Arizona

    Tucson, United States

    2 h-index

    6 publications

    116 citations

  6. Siemens (Germany)

    Munich, Germany

    1 h-index

    2 publications

    24 citations

  7. Thales (France)

    Paris, France

    1 h-index

    3 publications

    48 citations

  8. State Key Laboratory of Transducer Technology

    Shanghai, China

    1 h-index

    2 publications

    36 citations

1–8 of 22

Venues

  1. IEEE Microwave and Wireless Components Letters

    4 publications · 425 citations

    4

    h-index

  2. 3

    h-index

  3. IEEE Transactions on Advanced Packaging

    1 publications · 30 citations

    1

    h-index

  4. Microelectronics Reliability

    1 publications · 23 citations

    1

    h-index

  5. Trends in Food Science & Technology

    1 publications · 11 citations

    1

    h-index

1–5