Concepedia

High-speed Interface Design

High-Speed Interface Design is a methodology within mixed-signal integrated circuit development that enables the efficient transmission and reception of data signals at multi-gigabit per second rates by integrating precise analog front-ends with high-bandwidth digital protocols on a single chip.

152

Publications

4.8K

Citations

857

Authors

124

Institutions

Publications per year

2017–2026

23

Parents

Publications

152

Die Stacking (3D) Microarchitecture

Bryan Black, Daniel Pantuso, Paul A. Reed et al. · 2006 · 599 citations

, , +17

A portable digital DLL for high-speed CMOS interface circuits

B.W. Garlepp, Kevin Donnelly, Jun Kim et al. · IEEE Journal of Solid-State Circuits · 1999 · 188 citations

, , +17

The ORNL 10-meter small angle X-ray scattering camera

R. W. Hendricks · Journal of Applied Crystallography · 1978 · 153 citations

, , +16

1.27Gb/s/pin 3mW/pin wireless superconnect (WSC) interface scheme

Kensuke Kanda, Danardono Dwi Antono, Koichi Ishida et al. · 2003 · 136 citations

, , +11

A variable-frequency parallel I/O interface with adaptive power-supply regulation

Gu-Yeon Wei, Jong-Wook Kim, D. Liu et al. · IEEE Journal of Solid-State Circuits · 2000 · 123 citations

, , +17

1–5 of 152

Authors

857

  1. MH
    Mark Horowitz

    Stanford University, United States

    5 publications · 304 citations

    5

    h-index

  2. SS
    S. Sidiropoulos

    Stanford University, United States

    4 publications · 228 citations

    4

    h-index

  3. TK
    Tadahiro Kuroda

    Keio University, Japan

    4 publications · 226 citations

    4

    h-index

  4. YC
    Yiu-Fai Chan

    Rambus (United States), United States

    4 publications · 238 citations

    4

    h-index

  5. KD
    Kevin Donnelly

    Rambus (United States), United States

    4 publications · 238 citations

    4

    h-index

1–5 of 857

Institutions

124

  1. Samsung (South Korea)

    Seoul, South Korea

    11 h-index

    107 publications

    2.1K citations

  2. Rambus (United States)

    Sunnyvale, United States

    9 h-index

    100 publications

    4.1K citations

  3. NEC (Japan)

    Tokyo, Japan

    5 h-index

    19 publications

    483 citations

  4. Intel (United States)

    Santa Clara, United States

    5 h-index

    39 publications

    9K citations

  5. Pohang University of Science and Technology

    Pohang, South Korea

    5 h-index

    20 publications

    526 citations

  6. Stanford University

    Stanford, United States

    5 h-index

    11 publications

    938 citations

  7. Texas Instruments (United States)

    Dallas, United States

    5 h-index

    8 publications

    186 citations

  8. Xilinx (United States)

    San Jose, United States

    5 h-index

    9 publications

    258 citations

1–8 of 124

Venues

  1. IEEE Journal of Solid-State Circuits

    24 publications · 1.1K citations

    17

    h-index

  2. IEEE Transactions on Applied Superconductivity

    7 publications · 231 citations

    7

    h-index

  3. IEEE Transactions on Nuclear Science

    5 publications · 75 citations

    5

    h-index

  4. IBM Journal of Research and Development

    3 publications · 36 citations

    3

    h-index

  5. Microelectronics Reliability

    2 publications · 27 citations

    2

    h-index

1–5