1.27Gb/s/pin 3mW/pin wireless superconnect (WSC) interface scheme

Abstract

A low-power high-speed chip-to-chip interface scheme is described having a density of 625pins/mm/sup 2/. The interface utilizes capacitively coupled contactless minipads, return-to-half-V/sub 00/ signaling and sense amplifying F/F. The measured test chip fabricated in 0.35/spl mu/m CMOS delivers up to 1.27Gb/s/pin at 3mW/pin.