Device Isolation

Device Isolation is a fabrication technique in integrated circuit manufacturing that belongs to the class of processes designed to electrically separate adjacent semiconductor devices, distinguished by its implementation of physical or insulating structures to prevent unwanted current leakage and crosstalk between neighboring components on a chip.

232

Publications

7.7K

Citations

978

Authors

238

Institutions

Publications per year

2017–2026

21

Authors

978

  1. NE
    Nobuhiro Endo

    NEC (Japan), Japan

    4 publications · 100 citations

    4

    h-index

  2. KJ
    K.A. Jenkins

    IBM Research - Thomas J. Watson Research Center, United States

    4 publications · 113 citations

    4

    h-index

  3. JS
    J.K.O. Sin

    Hong Kong University of Science and Technology, Hong Kong SAR China

    4 publications · 97 citations

    4

    h-index

  4. YK
    Yukinori Kurogi

    NEC (Japan), Japan

    4 publications · 100 citations

    4

    h-index

  5. AI
    Akihiko Ishitani

    NEC (Japan), Japan

    4 publications · 100 citations

    4

    h-index

1–5 of 978

Venues

  1. IEEE Transactions on Electron Devices

    27 publications · 803 citations

    18

    h-index

  2. Journal of The Electrochemical Society

    JES · 10 publications · 301 citations

    10

    h-index

  3. Applied Physics Letters

    9 publications · 321 citations

    9

    h-index

  4. Japanese Journal of Applied Physics

    JJAP · 8 publications · 153 citations

    8

    h-index

  5. IEEE Electron Device Letters

    8 publications · 231 citations

    8

    h-index

1–5