Device Isolation
Device Isolation is a fabrication technique in integrated circuit manufacturing that belongs to the class of processes designed to electrically separate adjacent semiconductor devices, distinguished by its implementation of physical or insulating structures to prevent unwanted current leakage and crosstalk between neighboring components on a chip.
232
Publications
7.7K
Citations
978
Authors
238
Institutions
Publications per year
2017–2026
21
232
Isolation of junction devices in GaAs using proton bombardment
A.G. Foyt, W.T. Lindley, C. M. Wolfe et al. · Solid-State Electronics · 1969 · 175 citations
1–5 of 232
978
4
h-index
IBM Research - Thomas J. Watson Research Center, United States
4 publications · 113 citations
4
h-index
Hong Kong University of Science and Technology, Hong Kong SAR China
4 publications · 97 citations
4
h-index
4
h-index
4
h-index
1–5 of 978
238
Texas Instruments (United States)
Dallas, United States
10 h-index
49 publications
1.3K citations
Hewlett-Packard (United States)
Palo Alto, United States
9 h-index
22 publications
1.3K citations
IBM Research - Thomas J. Watson Research Center
Yorktown Heights, United States
9 h-index
40 publications
1.5K citations
AT&T (United States)
Bedminster, United States
8 h-index
33 publications
735 citations
Toshiba (Japan)
Tokyo, Japan
7 h-index
28 publications
1.2K citations

Hong Kong University of Science and Technology
Hong Kong, Hong Kong
6 h-index
19 publications
551 citations
NEC (Japan)
Tokyo, Japan
5 h-index
26 publications
669 citations

Centre National de la Recherche Scientifique
Paris, France
5 h-index
13 publications
543 citations
1–8 of 238
27 publications · 803 citations
18
h-index
JES · 10 publications · 301 citations
10
h-index
9 publications · 321 citations
9
h-index
JJAP · 8 publications · 153 citations
8
h-index
8 publications · 231 citations
8
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1–5