Concepedia

Destructive Packaging Testing

Destructive Packaging Testing is a methodological procedure in packaging inspection that involves the physical alteration or demolition of a package to evaluate its structural integrity, material properties, and performance characteristics under stress, distinguishing it from non-invasive or observational assessment techniques.

1

Publications

10

Citations

3

Authors

1

Institutions

Publications per year

2017–2026

0

Variants

Destructive Package Testing

Parents

Publications

1

Non Destructive Failure Analysis of 3D Electronic Packages Using Both Electro Optical Terahertz Pulse Reflectometry and 3D X-Ray Computed Tomography

Yan Li, Yongming Cai, Mario Pacheco et al. · Proceedings - International Symposium for Testing and Failure Analysis · 2012 · 13 citations

, , +17

Failure analysis of complex 3D stacked-die IC packages using Microwave Induced Plasma afterglow decapsulation

Jiaqi Tang, M.R. Curiel, S.L. Furcone et al. · 2015 · 12 citations

, , +13

Laser decapsulation of plastic packages for failure analysis: Process control and artefact investigations

A. Aubert, L. Dantas de Morais, J.-P. Rebrassé · Microelectronics Reliability · 2008 · 10 citations

, , +15

1–3 of 1

Authors

3

  1. AA
    A. Aubert

    Centre National de la Recherche Scientifique, France

    1 publications · 10 citations

    1

    h-index

  2. JR
    J.-P. Rebrassé

    STMicroelectronics (France), France

    1 publications · 10 citations

    1

    h-index

  3. LD
    L. Dantas de Morais

    STMicroelectronics (France), France

    1 publications · 10 citations

    1

    h-index

  4. SF
    S.L. Furcone

    J.M. Burgerscentrum, Netherlands

    1 publications · 12 citations

    0

    h-index

  5. CT
    C. Th. A. Revenberg

    Silex Microsystems (Sweden), Sweden

    1 publications · 12 citations

    0

    h-index

1–5 of 3

Institutions

1

  1. STMicroelectronics (France)

    Montrouge, France

    1 h-index

    3 publications

    30 citations

  2. J.M. Burgerscentrum

    Delft, Netherlands

    1 publications

    12 citations

  3. Biomass Technology Group (Netherlands)

    Enschede, The Netherlands

    1 publications

    12 citations

  4. Delft University of Technology

    Delft, The Netherlands

    1 publications

    12 citations

  5. Engineering Science Analysis (United States)

    Tempe, United States

    1 publications

    12 citations

  6. Intel (United States)

    Santa Clara, United States

    1 publications

    13 citations

1–6 of 1

Venues

  1. Microelectronics Reliability

    1 publications · 10 citations

    1

    h-index

1–2