Mario Pacheco

Three-dimensional (3D) microstructural characterization and quantification of reflow porosity in Sn-rich alloy/copper joints by X-ray tomography

Ling Jiang, Nikhilesh Chawla, Mario Pacheco et al. · Materials Characterization · 2011 · 46 citations

Natural Sciences, Materials Engineering, Materials Science +17

Detection and characterization of defects in microelectronic packages and boards by means of high-resolution x-ray computed tomography (CT)

Mario Pacheco, Deepak Goyal · 2011 · 32 citations

Natural Sciences, Electrical Engineering, Diagnostic Imaging +16

X-ray computed tomography for non-destructive failure analysis in microelectronics

Mario Pacheco, Deepak Goyal · 2010 · 28 citations

Veterinary Medicine, Radiology, Biomedical Imaging +14

Advanced Fault Isolation and Failure Analysis Techniques for Future Package Technologies

Mario Pacheco · Intel Technology Journal · 2005 · 23 citations

Engineering, Electrical Engineering, Materials Science +17

High resolution and fast throughput-time X-ray computed tomography for semiconductor packaging applications

Yan Li, Mario Pacheco, Deepak Goyal et al. · 2014 · 14 citations

Veterinary Medicine, Materials Engineering, Materials Science +15