Contact Annealing
Contact Annealing is a thermal processing technique used in semiconductor device fabrication, in which a metal-semiconductor junction is subjected to controlled heating to promote interfacial reactions that enhance electrical contact performance by reducing contact resistance and improving adhesion.
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2017–2026
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Thermal stability of W ohmic contacts to <i>n</i>-type GaN
M. W. Cole, D. W. Eckart, Woojae Han et al. · Journal of Applied Physics · 1996 · 167 citations
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IBM Research - Thomas J. Watson Research Center
Yorktown Heights, United States
11 h-index
29 publications
865 citations
IBM (United States)
Armonk, United States
7 h-index
18 publications
692 citations

Pennsylvania State University
State College, United States
7 h-index
20 publications
2.2K citations

DEVCOM Army Research Laboratory
Adelphi, United States
6 h-index
20 publications
1.6K citations

United States Naval Research Laboratory
Washington, United States
6 h-index
17 publications
346 citations

National Yang Ming Chiao Tung University
Hsinchu, Taiwan
5 h-index
18 publications
316 citations
Gwangju Institute of Science and Technology
Gwangju, South Korea
5 h-index
22 publications
774 citations
National University of Singapore
Singapore, Singapore
4 h-index
33 publications
773 citations
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34 publications · 1.4K citations
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30 publications · 1.5K citations
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JES · 9 publications · 145 citations
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10 publications · 160 citations
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JJAP · 8 publications · 231 citations
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