Contact Annealing

Contact Annealing is a thermal processing technique used in semiconductor device fabrication, in which a metal-semiconductor junction is subjected to controlled heating to promote interfacial reactions that enhance electrical contact performance by reducing contact resistance and improving adhesion.

200

Publications

6.8K

Citations

916

Authors

241

Institutions

Publications per year

2017–2026

20

Authors

916

  1. MM
    Masanori Murakami

    Kyoto University, Japan

    8 publications · 238 citations

    8

    h-index

  2. SE
    Suzanne E. Mohney

    Pennsylvania State University, United States

    6 publications · 267 citations

    6

    h-index

  3. WH
    W. H. Price

    Western General Hospital, United Kingdom

    6 publications · 199 citations

    6

    h-index

  4. MW
    M. W. Cole

    DEVCOM Army Research Laboratory, United States

    5 publications · 307 citations

    5

    h-index

  5. VR
    V. Rajagopal Reddy

    Sri Venkateswara University, India

    5 publications · 104 citations

    5

    h-index

1–5 of 916

Venues

  1. Journal of Applied Physics

    34 publications · 1.4K citations

    24

    h-index

  2. Applied Physics Letters

    30 publications · 1.5K citations

    21

    h-index

  3. Journal of The Electrochemical Society

    JES · 9 publications · 145 citations

    9

    h-index

  4. IEEE Electron Device Letters

    10 publications · 160 citations

    9

    h-index

  5. Japanese Journal of Applied Physics

    JJAP · 8 publications · 231 citations

    8

    h-index

1–5