Concepedia

Conductive Pastes

Conductive Paste is a composite material formulation consisting of electrically conductive particles dispersed in a binder matrix, distinguished by its ability to form conductive traces or interconnects through screen printing or dispensing processes in microwave and electronic device fabrication.

134

Publications

5.6K

Citations

553

Authors

183

Institutions

Publications per year

2017–2026

48

Variants

Conductive Paste

Parents

Publications

134

Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: Materials, processing, reliability and applications

Yi Li, C.P. Wong · Materials Science and Engineering R Reports · 2006 · 706 citations

, , +17

Highly Conductive, Flexible, Polyurethane‐Based Adhesives for Flexible and Printed Electronics

Zhuo Li, Rongwei Zhang, Kyoung‐sik Moon et al. · Advanced Functional Materials · 2012 · 191 citations

, , +14

Formulation and screen printing of water based conductive flake silver pastes onto green ceramic tapes for electronic applications

Rita Faddoul, Nadège Reverdy-Bruas, Anne Blayo · Materials Science and Engineering B · 2012 · 164 citations

, , +15

Reliability of electrically conductive adhesive joints for surface mount applications: a summary of the state of the art

J.C. Jagt · IEEE Transactions on Components Packaging and Manufacturing Technology Part A · 1998 · 156 citations

, , +13

Conductivity of silver paste prepared from nanoparticles

Keunju Park, Dong-Seok Seo, Jong‐Kook Lee · Colloids and Surfaces A Physicochemical and Engineering Aspects · 2007 · 153 citations

, , +12

1–5 of 134

Authors

553

  1. CW
    C.P. Wong

    Georgia Institute of Technology, United States

    5 publications · 1.2K citations

    5

    h-index

  2. MJ
    Małgorzata Jakubowska

    Warsaw University of Technology, Poland

    5 publications · 131 citations

    5

    h-index

  3. AM
    Anna Młożniak

    Institute of Electronic Materials Technology, Poland

    3 publications · 71 citations

    3

    h-index

  4. YW
    Yiu-Huen Wong

    AT&T (United States), United States

    2 publications · 53 citations

    2

    h-index

  5. JA
    Jung Ah Lim

    Korea Institute of Science and Technology, South Korea

    2 publications · 44 citations

    2

    h-index

1–5 of 553

Institutions

183

  1. Warsaw University of Technology

    Warsaw, Poland

    5 h-index

    13 publications

    499 citations

  2. Georgia Institute of Technology

    Atlanta, United States

    5 h-index

    16 publications

    3.6K citations

  3. Institute of Electronic Materials Technology

    Warsaw, Poland

    4 h-index

    10 publications

    240 citations

  4. National Cheng Kung University

    Tainan City, Taiwan

    3 h-index

    8 publications

    157 citations

  5. DuPont (United States)

    Wilmington, United States

    3 h-index

    18 publications

    290 citations

  6. École Polytechnique Fédérale de Lausanne

    Lausanne, Switzerland

    3 h-index

    7 publications

    75 citations

  7. National Institute of Advanced Industrial Science and Technology

    Tsukuba, Japan

    3 h-index

    10 publications

    189 citations

  8. Division of Materials Science and Engineering

    Canberra, Australia

    3 h-index

    8 publications

    284 citations

1–8 of 183

Venues

  1. Journal of Electronic Materials

    JEM · 7 publications · 155 citations

    8

    h-index

  2. Advanced Functional Materials

    6 publications · 449 citations

    6

    h-index

  3. 5

    h-index

  4. Energy Procedia

    3 publications · 71 citations

    3

    h-index

  5. Applied Surface Science

    3 publications · 62 citations

    3

    h-index

1–5