Concepedia

Capacitive Sensor Packaging

Capacitive Sensor Packaging is a specialized method in sensor engineering that integrates capacitive sensing elements with protective and functional materials to ensure electrical stability, mechanical durability, and environmental resilience while maintaining optimal capacitive coupling and signal integrity.

10

Publications

284

Citations

44

Authors

17

Institutions

Publications per year

2017–2026

2

Parents

Publications

10

A Fully Packaged CMOS Interdigital Capacitive Humidity Sensor With Polysilicon Heaters

Chenglong Zhao, Ming Qin, Qing‐An Huang · IEEE Sensors Journal · 2011 · 68 citations

, , +16

A Glass-in-Silicon Reflow Process for Three-Dimensional Microsystems

Razi Haque, Kensall D. Wise · Journal of Microelectromechanical Systems · 2013 · 48 citations

, , +17

Touch mode capacitive pressure sensors for industrial applications

Wen H. Ko, Qiang Wang · 2002 · 48 citations

, , +17

Research on a 3D Encapsulation Technique for Capacitive MEMS Sensors Based on Through Silicon Via

Meng Zhang, Jian Yang, Yurong He et al. · Sensors · 2018 · 26 citations · Full text

, , +17

Low-Pressure Wafer-Level-Packaged Capacitive Accelerometers With High Dynamic Range and Wide Bandwidth Using Nano-Gap Sloped Electrode Design

Yaesuk Jeong, Diego Emilio Serrano, Farrokh Ayazi · Journal of Microelectromechanical Systems · 2017 · 23 citations

, , +17

1–5 of 10

Authors

44

  1. WH
    Wen H. Ko

    Case Western Reserve University, United States

    2 publications · 66 citations

    2

    h-index

  2. GH
    Guowei Han

    Chinese Academy of Sciences, China

    1 publications · 26 citations

    1

    h-index

  3. MN
    M. Nagata

    Virginia Tech, United States

    1 publications · 15 citations

    1

    h-index

  4. DB
    David B. Heinz

    Stanford University, United States

    1 publications · 11 citations

    1

    h-index

  5. CS
    Chaowei Si

    Chinese Academy of Sciences, China

    1 publications · 26 citations

    1

    h-index

1–5 of 44

Institutions

17

  1. Case Western Reserve University

    Cleveland, United States

    2 h-index

    5 publications

    150 citations

  2. University of Michigan

    Ann Arbor, United States

    1 h-index

    1 publications

    48 citations

  3. Azbil (Japan)

    Tokyo, Japan

    1 h-index

    6 publications

    90 citations

  4. Laboratoire d'Électronique des Technologies de l'Information

    Grenoble, France

    1 h-index

    4 publications

    60 citations

  5. Georgia Institute of Technology

    Atlanta, United States

    1 h-index

    2 publications

    46 citations

  6. CEA Grenoble

    Grenoble, France

    1 h-index

    4 publications

    60 citations

  7. State Key Laboratory of Transducer Technology

    Shanghai, China

    1 h-index

    1 publications

    26 citations

  8. Institute of Semiconductors

    Beijing, China

    1 h-index

    7 publications

    182 citations

1–8 of 17

Venues

  1. Journal of Microelectromechanical Systems

    2 publications · 71 citations

    2

    h-index

  2. 1

    h-index

  3. Journal of Micromechanics and Microengineering

    JMM · 1 publications · 15 citations

    1

    h-index

  4. IEEE Sensors Journal

    1 publications · 68 citations

    1

    h-index

  5. Sensors

    1 publications · 26 citations

    1

    h-index

1–5