G. Besnard

3D sequential stacked planar devices on 300 mm wafers featuring replacement metal gate junction-less top devices processed at 525°C with improved reliability

A. Vandooren, J. Franco, Bertrand Parvais et al. · 2018 · 25 citations

Engineering, Electrical Engineering, Microelectronics +16

Fabrication and measurements of plastic scintillating fibers

P. Rebourgeard, F. Rondeaux, J.P. Baton et al. · Nuclear Instruments and Methods in Physics Research Section A Accelerators Spectrometers Detectors and Associated Equipment · 1999 · 21 citations

Natural Sciences, Materials Engineering, Materials Science +10

Demonstration of 3D sequential FD-SOI on CMOS FinFET stacking featuring low temperature Si layer transfer and top tier device fabrication with tier interconnections

A. Vandooren, Narendra Parihar, J. Franco et al. · 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) · 2022 · 20 citations

Engineering, Computer Engineering, Electrical Engineering +17

Chalcopyrite thin-film solar cells by industry-compatible ink-based process

Frédéric Le Roux, S. Amtablian, M. A. Antón et al. · Solar Energy Materials and Solar Cells · 2013 · 19 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +14

3D Sequential Low Temperature Top Tier Devices using Dopant Activation with Excimer Laser Anneal and Strained Silicon as Performance Boosters

A. Vandooren, Zhicheng Wu, Narendra Parihar et al. · 2020 · 18 citations

Engineering, Electrical Engineering, Materials Science +17