K.N. Kim

Characteristics of TiN barrier layer against Cu diffusion

Mi-Kyung Kwak, D. H. Shin, Tae-Won Kang et al. · Thin Solid Films · 1999 · 85 citations

Materials Engineering, Materials Science, Engineering +5

Ongoing Evolution of DRAM Scaling via Third Dimension -Vertically Stacked DRAM -

Ji Won Han, S.H. Park, Moonyoung Jeong et al. · 2023 · 60 citations

Third Dimension, Bit Density, Electrical Engineering +15

Highly Manufacturable 1Gb SDRAM

K.N. Kim, J.Y. Lee, Kam Ho Lee et al. · 1997 · 23 citations

Engineering, Flash Memory, Computer Engineering +6

Novel body tied FinFET cell array transistor DRAM with negative word line operation for sub 60nm technology and beyond

C.H. Lee, Jae-Man Yoon, C. Lee et al. · 2004 · 22 citations

Finfet Dram, Non-volatile Memory, Electrical Engineering +12

A 0.13 μm DRAM technology for giga bit density stand-alone and embedded DRAMs

K.N. Kim, Taeyoung Chung, Hongsik Jeong et al. · 2002 · 10 citations