Yung-Te Lin

Publications

Citations

H-Index

2000

Active since

Affiliations

National Center for High-Performance Computing(Current)

Yung-Te Lin is an author at National Center for High-Performance Computing specializing in electronic packaging, industrial engineering, and reliability.

Top concepts

3D PrintingEngineeringReliabilityMaterial ScienceMicroelectronicsMicrofabricationElectronic PackagingElectrical EngineeringIndustrial EngineeringMechanical Engineering

Publications per year

2000–2000

Publications

On enhancing eutectic solder joint reliability using a second-reflow-process approach

Kuo‐Ning Chiang, Yung-Te Lin, Hsien‐Chie Cheng · IEEE Transactions on Advanced Packaging · 2000 · 44 citations

Engineering, Second-reflow-process Approach, Industrial Engineering +19

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