Concepedia

K. Weide-Zaage

KW

Statistics

Publications

7

Citations

209

H-Index

7

Active since

2001

Affiliations

Institut Polytechnique de Bordeaux(Current)

Leibniz University Hannover

Université de Bordeaux

Infection et inflammation

K. Weide-Zaage is an author at Institut Polytechnique de Bordeaux specializing in electronic packaging, engineering, and mechanical engineering.

Top concepts

EngineeringElectronic PackagingElectrical EngineeringMechanical EngineeringApplied PhysicsMicroelectronicsHeat TransferSolid MechanicsThermal EngineeringTransport Phenomena

Publications per year

2001–2021

7

Publications

7

Three-Dimensional Voids Simulation in chip Metallization Structures: a Contribution to Reliability Evaluation

David Dalleau, K. Weide-Zaage · Microelectronics Reliability · 2001 · 112 citations

Engineering, Mechanical Engineering, Computer-aided Design +17

Moisture diffusion in Printed Circuit Boards: Measurements and Finite- Element- Simulations

K. Weide-Zaage, Walter Horaud, H. Frémont · Microelectronics Reliability · 2005 · 21 citations

Electrical Engineering, Moisture Diffusion, Engineering +15

Thermal analysis of the design parameters of a QFN package soldered on a PCB using a simulation approach

Kai Hollstein, Xinyi Yang, K. Weide-Zaage · Microelectronics Reliability · 2021 · 20 citations

Qfn Package, Electrical Engineering, Chip-scale Package +11

Electro- and thermo-migration induced failure mechanisms in Package on Package

L. Meinshausen, K. Weide-Zaage, H. Frémont · Microelectronics Reliability · 2012 · 17 citations

Advanced Packaging, Electrical Engineering, Chip-scale Package +4

Migration induced IMC formation in SAC305 solder joints on Cu, NiAu and NiP metal layers

L. Meinshausen, H. Frémont, K. Weide-Zaage · Microelectronics Reliability · 2012 · 14 citations

Materials Science, Materials Engineering, Electromigration Technique +12

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