Concepedia
Statistics
Publications
2
Citations
31
H-Index
Active since
2012
Affiliations
Leibniz University Hannover(Current)
Infection et inflammation
Université de Bordeaux
Institut Polytechnique de Bordeaux
H. Frémont is an author at Leibniz University Hannover specializing in electronic packaging, engineering, and materials science.
Top concepts
EngineeringElectronic PackagingCorrosionMicrostructureApplied PhysicsMaterial ScienceAdvanced PackagingMaterials EngineeringElectrical Engineering
Publications per year
2012–2012
Electro- and thermo-migration induced failure mechanisms in Package on Package
L. Meinshausen, K. Weide-Zaage, H. Frémont · Microelectronics Reliability · 2012 · 17 citations
Advanced Packaging, Electrical Engineering, Chip-scale Package +4
Migration induced IMC formation in SAC305 solder joints on Cu, NiAu and NiP metal layers
L. Meinshausen, H. Frémont, K. Weide-Zaage · Microelectronics Reliability · 2012 · 14 citations
Materials Science, Materials Engineering, Electromigration Technique +12
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