Do-Seop Kim is an author at Yokohama National University specializing in materials science, engineering, and mechanics of materials.
Top concepts
EngineeringMaterial ScienceMechanical EngineeringMechanics Of MaterialsCorrosionSolid MechanicsElectronic PackagingFinite Element MethodMechanicsMechanical Behavior
Publications per year
2003–2007
3
3
Effect of void formation on thermal fatigue reliability of lead-free solder joints
Do-Seop Kim, Qiang Yu, Tadahiro Shibutani et al. · 2004 · 36 citations
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