Do-Seop Kim - Concepedia

Author

Do-Seop Kim

Also Known As

Do-Seop Kim

Publications

Citations

H-Index

Concepts

All Affiliations

Do-Seop Kim is an author at Yokohama National University specializing in materials science, engineering, and mechanics of materials.

#	Concept	H-Index	Publications	Citations
1	Engineering	3	3	88
2	Materials Science	3	3	88
3	Mechanical Engineering	3	3	88
4	Mechanics	1	1	10
5	Mechanical Behavior	1	1	10

Do-Seop Kim

Publications

Citations

H-Index

Page 1

	Year	Citations
Effect of process-induced voids on isothermal fatigue resistance of CSP lead-free solder joints Qiang Yu, Tadahiro Shibutani, Do-Seop Kim, Microelectronics Reliability Materials ScienceIsothermal Fatigue ResistanceEngineeringDurability PerformanceCorrosion	2007	42
Effect of void formation on thermal fatigue reliability of lead-free solder joints Do-Seop Kim, Qiang Yu, Tadahiro Shibutani, Shear StrainEngineeringMechanical EngineeringSn-pb SolderStructural Integrity	2004	36
Nonlinear Behavior Study on Effect of Hardening Rule of Lead Free Solder Joint Do-Seop Kim, Qiang Yu, Tadahiro Shibutani, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1 Materials ScienceFinite Element MethodEngineeringMechanical BehaviorMechanics	2003	10

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