Qiang Yu is an author at Yokohama National University specializing in electronic packaging, mechanical engineering, and mechanics of materials.
Top concepts
EngineeringElectronic PackagingMechanical EngineeringMechanics Of MaterialsCorrosionStatisticsReliabilitySafety ScienceSolid MechanicsMaterial Science
Publications per year
2004–2004
2
2
Effect of void formation on thermal fatigue reliability of lead-free solder joints
Do-Seop Kim, Qiang Yu, Tadahiro Shibutani et al. · 2004 · 36 citations
The examination of the drop impact test method
Qiang Yu, K. Watanabe, Toshihiro Tsurusawa et al. · 2004 · 21 citations
Rows per page
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