Effect of process-induced voids on isothermal fatigue resistance of CSP lead-free solder joints - Concepedia

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Effect of process-induced voids on isothermal fatigue resistance of CSP lead-free solder joints

42

Citations

15

References

2007

Year

Qiang Yu, Tadahiro Shibutani, Do-Seop Kim, Yusuke Kobayashi, Jidong Yang, Masaki SHIRATORI

Microelectronics Reliability

Materials ScienceIsothermal Fatigue ResistanceEngineeringDurability PerformanceCorrosionMechanical EngineeringProcess-induced VoidsElectronic PackagingLow-cycle FatigueMechanics Of MaterialsWear Resistance

References

	Year	Citations

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