K. Tsuruta

Control circuit in an in-pipe wireless micro inspection robot

K. Tsuruta, Takanari Sasaya, Takayuki Shibata et al. · 2002 · 17 citations

Engineering, Electrical Engineering, Robotics Engineering +9

Low-pressure sintering bonding with Cu and CuO flake paste for power devices

S. W. Park, R. Uwataki, Shijo Nagao et al. · 2014 · 16 citations

Natural Sciences, Materials Engineering, Materials Science +16

Wireless link system for communication and energy transmission of microrobot

N. Mitumoto, K. Tsuruta, Takayuki Shibata et al. · 2002 · 13 citations

Engineering, Electrical Engineering, Robotics Engineering +12

Reverse Electrical Characteristics of 4H-SiC JBS Diodes Fabricated on In-House Substrate with Low Threading Dislocation Density

Fujiwara Hirokazu, Masaki Konishi, T. Ohnishi et al. · Materials science forum · 2011 · 12 citations · Full text

Engineering, Electrical Engineering, Materials Science +17

Quasi-transient liquid-phase bonding by eutectic reaction of Sn-plated Zn on Cu substrate for high-temperature die attachment

S.W. Park, Shijo Nagao, Yoshitaka Kato et al. · Journal of Alloys and Compounds · 2015 · 11 citations

Natural Sciences, Materials Engineering, Materials Science +17