C. Lazik

HKMG process impact on N, P BTI: Role of thermal IL scaling, IL/HK integration and post HK nitridation

K. Joshi, Shih‐Ya Hung, Subhadeep Mukhopadhyay et al. · 2013 · 60 citations

Engineering, Electrical Engineering, Materials Science +17

Ultra-low NMOS contact resistivity using a novel plasma-based DSS implant and laser anneal for post 7 nm nodes

Chi‐Nung Ni, K. V. Rao, Fareen Adeni Khaja et al. · 2016 · 39 citations

Engineering, Electrical Engineering, Materials Science +17

Ultra-low contact resistivity with highly doped Si:P contact for nMOSFET

Chi‐Nung Ni, X. Li, Shashank Sharma et al. · 2015 · 37 citations

Engineering, Electrical Engineering, Materials Science +15

Facile Synthesis of Bimetallic Ag/Ni Core/Sheath Nanowires and Their Magnetic and Electrical Properties

Maureen McKiernan, Jie Zeng, Sunzida Ferdous et al. · Small · 2010 · 29 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +17

Through-silicon-via technology for 3D integration

John Dukovic, S. Ramaswami, Sharma Pamarthy et al. · 2010 · 25 citations

Engineering, Computer Engineering, Electrical Engineering +17