Chi‐Nung Ni

HKMG process impact on N, P BTI: Role of thermal IL scaling, IL/HK integration and post HK nitridation

K. Joshi, Shih‐Ya Hung, Subhadeep Mukhopadhyay et al. · 2013 · 60 citations

Engineering, Electrical Engineering, Materials Science +17

Ultra-low NMOS contact resistivity using a novel plasma-based DSS implant and laser anneal for post 7 nm nodes

Chi‐Nung Ni, K. V. Rao, Fareen Adeni Khaja et al. · 2016 · 39 citations

Engineering, Electrical Engineering, Materials Science +17

Ultra-low contact resistivity with highly doped Si:P contact for nMOSFET

Chi‐Nung Ni, X. Li, Shashank Sharma et al. · 2015 · 37 citations

Engineering, Electrical Engineering, Materials Science +15

Fin Doping by Hot Implant for 14nm FinFET Technology and Beyond

Bingxi Wood, Fareen Adeni Khaja, B. Colombeau et al. · ECS Transactions · 2013 · 28 citations

Engineering, Electrical Engineering, Materials Science +17

Ultra low p-type SiGe contact resistance FinFETs with Ti silicide liner using cryogenic contact implantation amorphization and Solid-Phase Epitaxial Regrowth (SPER)

Yu‐Chi Yang, N. Breil, C. Y. Yang et al. · 2016 · 26 citations

Engineering, Electrical Engineering, Materials Science +13