Concepedia

Author

Chi‐Nung Ni

Applied Materials (United States)

Also Known As

C. N. Ni, C. Ni, C.-N Ni, C.-N. Ni, C.N. Ni, Chenyin Ni, Chi-Nung Ni, Chi‐Nung Ni

22

Publications

237

Citations

8

H-Index

20

Concepts

All Affiliations

Applied Materials (United States)Pennsylvania State UniversityIndian Institute of Technology Bombay
CN

About

Chi‐Nung Ni is an author at Applied Materials (United States) specializing in engineering, applied physics, and electrical engineering.

Top Concepts

#ConceptH-IndexPublicationsCitations

1

Engineering

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2

Applied Physics

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6

201

3

Electrical Engineering

6

6

201

4

Materials Engineering

2

2

86

5

Computer Engineering

1

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12

Chi‐Nung Ni

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7

Publications

211

Citations

7

H-Index

YearCitations

HKMG process impact on N, P BTI: Role of thermal IL scaling, IL/HK integration and post HK nitridation

K. Joshi, Shih‐Ya Hung, Subhadeep Mukhopadhyay,

2013

60

Ultra-low NMOS contact resistivity using a novel plasma-based DSS implant and laser anneal for post 7 nm nodes

Chi‐Nung Ni, K. V. Rao, Fareen Adeni Khaja,

2016

39

Ultra-low contact resistivity with highly doped Si:P contact for nMOSFET

Chi‐Nung Ni, X. Li, Shashank Sharma,

2015

36

Fin Doping by Hot Implant for 14nm FinFET Technology and Beyond

Bingxi Wood, Fareen Adeni Khaja, B. Colombeau,

ECS Transactions

2013

28

Ultra low p-type SiGe contact resistance FinFETs with Ti silicide liner using cryogenic contact implantation amorphization and Solid-Phase Epitaxial Regrowth (SPER)

Yu‐Chi Yang, N. Breil, C. Y. Yang,

2016

26

Scaled Gate Stacks for Sub-20-nm CMOS Logic Applications Through Integration of Thermal IL and ALD HfOx

K. Joshi, Shih‐Ya Hung, Subhadeep Mukhopadhyay,

IEEE Electron Device Letters

2012

12

PMOS contact resistance solution compatible to CMOS integration for 7 nm node and beyond

Chi‐Nung Ni, Yongbing Huang, Sung Chan Jun,

2016

10

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