Concepedia

Fang-Jun Leu

FL

Statistics

Publications

3

Citations

55

H-Index

3

Active since

2005

Affiliations

Industrial Technology Research Institute(Current)

Fang-Jun Leu is an author at Industrial Technology Research Institute specializing in engineering, electronic packaging, and electrical engineering.

Top concepts

EngineeringMicroelectronicsElectronic PackagingElectrical Engineering3D PrintingMicrofabricationComputer EngineeringApplied PhysicsNanoelectronicsIndustrial Design

Publications per year

2005–2013

3

Publications

3

Investigation of pre-bending substrate design in packaging assembly of an IGBT power module

Chang‐Chun Lee, Kuo‐Shu Kao, Leon Lin et al. · Microelectronic Engineering · 2013 · 23 citations

Packaging Assembly, Electrical Engineering, Chip-scale Package +9

Development and characterization of low cost ultrathin 3D interconnect

Wei‐Chung Lo, Yuhua Chen, Jeng-Dar Ko et al. · 2005 · 18 citations

3D Ic Architecture, Electrical Engineering, Economic Criteria +14

Chip Embedded Wafer Level Packaging Technology for Stacked RF-SiP Application

Chien-Wei Chien, Li‐Cheng Shen, Tao‐Chih Chang et al. · 2007 · 14 citations

Industrial Design, Electrical Engineering, Stacked Rf-sip Application +14

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