T.T. Kuo

Inhibiting the growth of Cu3Sn and Kirkendall voids in the Cu/Sn-Ag-Cu system by minor Pd alloying

Cheng En Ho, T.T. Kuo, Chun Chien Wang et al. · Electronic Materials Letters · 2012 · 61 citations

Materials Engineering, Materials Science, Engineering +8

IMC microstructure modification and mechanical reinforcement of Sn–Ag–Cu/Cu microelectronic joints through an advanced surface finish technique

Cheng–En Ho, Shu-Ying Yang, Pei-Tzu Lee et al. · Journal of Materials Research and Technology · 2021 · 39 citations · Full text

Materials Science, Advanced Packaging, Imc Microstructure +15

Reliability evaluation on a submicron Ni(P) thin film for lead-free soldering

Cheng–En Ho, C.W. Fan, Wei Wu et al. · Thin Solid Films · 2012 · 22 citations

Materials Science, Materials Engineering, Electrical Engineering +13

Development and Evaluation of Direct Deposition of Au/Pd(P) Bilayers over Cu Pads in Soldering Applications

Cheng–En Ho, T.T. Kuo, Wojciech Gierlotka et al. · Journal of Electronic Materials · 2012 · 21 citations

Materials Engineering, Materials Science, Engineering +7

Influence of Pd(P) thickness on the Pd-free solder reaction between eutectic Sn-Ag alloy and Au/Pd(P)/Ni(P)/Cu multilayer

C.Y. Lee, Shu-Ying Yang, C.H. Yang et al. · Surface and Coatings Technology · 2020 · 19 citations

Materials Engineering, Materials Science, Engineering +3