Tae-Sung Oh

Fabrication of tin oxide film by sol–gel method for photovoltaic solar cell system

Seung‐Chul Lee, Jaeho Lee, Tae-Sung Oh et al. · Solar Energy Materials and Solar Cells · 2003 · 103 citations

Materials Science, Electrical Engineering, Engineering +13

High Frequency Electrical Model of Through Wafer Via for 3-D Stacked Chip Packaging

Chunghyun Ryu, Jiwang Lee, Hyein Lee et al. · 2006 1st Electronic Systemintegration Technology Conference · 2006 · 94 citations

Engineering, Electromagnetic Compatibility, Physical Design (Electronics) +19

Thermoelectric Characteristics of n-Type Bi<sub>2</sub>Te<sub>3</sub> and p-Type Sb<sub>2</sub>Te<sub>3</sub> Thin Films Prepared by Co-Evaporation and Annealing for Thermopile Sensor Applications

Jaehwan Kim, Jung-Yeol Choi, Jae-Man Bae et al. · MATERIALS TRANSACTIONS · 2013 · 79 citations · Full text

Thin Film Physics, Engineering, Thin Films Prepared +22

Thermoelectric properties of the bismuth–antimony–telluride and the antimony–telluride films processed by electrodeposition for micro-device applications

Su-Kyum Lim, Minyoung Kim, Tae-Sung Oh · Thin Solid Films · 2009 · 68 citations

Materials Science, Materials Engineering, Engineering +9

High frequency electrical circuit model of chip-to-chip vertical via interconnection for 3-D chip stacking package

Chunghyun Ryu, Daehyun Chung, Jun Ho Lee et al. · 2006 · 53 citations

Engineering, Vlsi Design, Vector Network +16