Concepedia

J. Leib

JL

8

Publications

496

Citations

8

H-Index

1995

Active since

Affiliations

Schott (Germany)(Current)

University of Bayreuth

Institute of Experimental Physics of the Slovak Academy of Sciences

Fraunhofer Institute for Reliability and Microintegration

J. Leib is an author at Schott (Germany) specializing in engineering, applied physics, and electronic packaging.

Top concepts

EngineeringApplied PhysicsMaterial ScienceMicroelectronicsMicrofabricationElectronic PackagingElectrical Engineering3D PrintingIntegrated CircuitsPhysics

Publications per year

1995–2017

8

Publications

8

A 10nm high performance and low-power CMOS technology featuring 3<sup>rd</sup> generation FinFET transistors, Self-Aligned Quad Patterning, contact over active gate and cobalt local interconnects

C. Auth, A. Aliyarukunju, M. Asoro et al. · 2017 · 353 citations

Engineering, Integrated Circuits, High Performance +18

Field and excitation dependent ultrasonic attenuation in3He-B

S. Götz, M. Huebner, J. Leib et al. · Journal of Low Temperature Physics · 1995 · 44 citations

Engineering, Physics, Ultrasonics +6

Conduction Mechanism in RuO2-Based Thick Films

V. Pavl�k, Nikiforova Ov, C. J. Adkins et al. · physica status solidi (b) · 1998 · 25 citations

Plasma Etching of Tapered Features in Silicon for MEMS and Wafer Level Packaging Applications

Ha-Duong Ngo, André Hiess, V. Seidemann et al. · Journal of Physics Conference Series · 2006 · 23 citations · Full text

Electrical Engineering, Wafer Scale Processing, Engineering +14

Novel microstructuring technology for glass on silicon and glass-substrates

Dietrich Mund, J. Leib · 2004 · 17 citations

Materials Science, Materials Engineering, Glass-ceramic +14

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