Thorbjörn Ebefors - Concepedia

Author

Thorbjörn Ebefors

KTH Royal Institute of Technology

Also Known As

Thorbjorn Ebefors, Thorbjörn Ebefors

Publications

312

Citations

H-Index

Concepts

All Affiliations

KTH Royal Institute of Technology Silex Microsystems (Sweden)Chalmers University of Technology Mycronic (Sweden)

About

Thorbjörn Ebefors is an author at KTH Royal Institute of Technology specializing in engineering, electrical engineering, and microfabrication.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	6	6	238
2	Electrical Engineering	4	4	151
3	Applied Physics	3	3	137
4	Materials Science	3	3	141
5	Computer Engineering	1	1	55

Thorbjörn Ebefors

Publications

282

Citations

H-Index

Page 1

	Year	Citations
The development and evaluation of RF TSV for 3D IPD applications Thorbjörn Ebefors, Jessica Fredlund, Daniel Perttu, EngineeringSilicon ViasPartners TnoRf TsvIntegrated Circuits	2013	55
New small radius joints based on thermal shrinkage of polyimide in V-grooves for robust self-assembly 3D microstructures Thorbjörn Ebefors, Edvard Kälvesten, Göran Stemme Journal of Micromechanics and Microengineering Materials ScienceSimple TechnologyEngineeringSoft RoboticsFlexible Electronics	1998	49
Low-Loss, High-Linearity RF Interposers Enabled by Through Glass Vias Umer Shah, Jessica Liljeholm, James Campion, IEEE Microwave and Wireless Components Letters Advanced Packaging3D Ic ArchitectureElectrical EngineeringWafer Scale ProcessingEngineering	2018	45
Dynamic actuation of polyimide V-groove joints by electrical heating Thorbjörn Ebefors, Edvard Kälvesten, Göran Stemme Sensors and Actuators A Physical EngineeringDynamic ActuationMechanicsMechanical EngineeringSolid Mechanics	1998	38
Through-Glass Vias for Glass Interposers and MEMS Packaging Applications Fabricated Using Magnetic Assembly of Microscale Metal Wires Miku J. Laakso, Simon J. Bleiker, Jessica Liljeholm, IEEE Access EngineeringInterconnect (Integrated Circuits)Micro-electromechanical SystemAdvanced Packaging (Semiconductors)Glass Interposers	2018	37
Inkjet printing technology for increasing the I/O density of 3D TSV interposers Behnam Khorramdel, Jessica Liljeholm, Mika-Matti Laurila, Microsystems & Nanoengineering	2017	34
A Micromachined Coupled-Cantilever for Piezoelectric Energy Harvesters Agin Vyas, Henrik Staaf, Cristina Rusu, Micromachines Extended Stress DistributionElectrical EngineeringEnergy HarvestingEngineeringFlexible Electronics	2018	14
Permeability Enhancement by Multilayer Ferromagnetic Composites for Magnetic-Core On-Chip Inductors Umer Shah, Jessica Liljeholm, Thorbjörn Ebefors, IEEE Microwave and Wireless Components Letters	2014	10

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