Concepedia

C. Chang

CC

8

Publications

209

Citations

8

H-Index

1999

Active since

Affiliations

Agilent Technologies (United States)(Current)

C. Chang is an author at Agilent Technologies (United States) specializing in engineering, electronic packaging, and mechanical engineering.

Top concepts

EngineeringMaterial ScienceElectronic PackagingMechanical EngineeringMicroelectronicsMicrofabricationMechanics Of MaterialsMicrostructureSolid MechanicsComputer Engineering

Publications per year

1999–2003

8

Publications

8

Effects of underfill material properties on the reliability of solder bumped flip chip on board with imperfect underfill encapsulants

John H. Lau, S. W. Ricky Lee, C. Chang · IEEE Transactions on Components and Packaging Technologies · 2000 · 66 citations

Engineering, Mechanical Engineering, Flip Chip +18

Characterization of underfill materials for functional solder bumped flip chips on board applications

Jia-Shen Lan, C. Chang · IEEE Transactions on Components and Packaging Technologies · 1999 · 28 citations

Engineering, Mechanical Engineering, Advanced Packaging (Semiconductors) +16

Failure analysis of solder bumped flip chip on low-cost substrates

John H. Lau, C. Chang, S. W. Ricky Lee · IEEE Transactions on Electronics Packaging Manufacturing · 2000 · 27 citations

Engineering, Mechanical Engineering, Flip Chip +17

Taguchi design of experiment for wafer bumping by stencil printing

John H. Lau, C. Chang · IEEE Transactions on Electronics Packaging Manufacturing · 2000 · 23 citations

Materials Engineering, Materials Science, Industrial Design +14

Effects of underfill material properties on the reliability of solder bumped flip chip on board with imperfect underfill encapsulants

John H. Lau, S.-W.R. Lee, C. Chang et al. · 2003 · 21 citations

Materials Science, Flip Chip, Chip-scale Package +14

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