Concepedia

S.-W.R. Lee

SL

1

Publications

21

Citations

1

H-Index

2003

Active since

S.-W.R. Lee is an author specializing in mechanics of materials, microfabrication, and mechanical engineering.

Top concepts

EngineeringMaterial ScienceMicroelectronicsMicrofabricationElectronic PackagingMechanical EngineeringMechanics Of Materials

Publications per year

2003–2003

1

Publications

1

Effects of underfill material properties on the reliability of solder bumped flip chip on board with imperfect underfill encapsulants

John H. Lau, S.-W.R. Lee, C. Chang et al. · 2003 · 21 citations

Materials Science, Flip Chip, Chip-scale Package +14

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