Tiao Zhou

JEDEC board drop test simulation for wafer level packages (WLPs)

Harpreet S. Dhiman, Xuejun Fan, Tiao Zhou · 2009 · 32 citations

Engineering, Mechanical Engineering, Mechanical Behavior Of Materials +16

Modeling techniques for board level drop test for a wafer-level package

Harpreet S. Dhiman, Xuejun Fan, Tiao Zhou · 2008 · 29 citations

Engineering, Computer Engineering, Finite Element Analysis +16

Board level temperature cycling study of large array Wafer Level Package

Mahdi Rahim, Tiao Zhou, Xuejun Fan et al. · 2009 · 25 citations

Engineering, Computer Engineering, Heat Transfer +16

Resonance prediction of deep sediment valleys through an eigenvalue method

Tiao Zhou, Marijan Dravinski · Geophysical Journal International · 1994 · 11 citations

Engineering, Earth Sciences, Computational Fluid Dynamics +12

Larger Array Fine Pitch Wafer Level Package Drop Test Reliability

Tiao Zhou, Robert Derk, Kaysar Rahim et al. · 2009 · 10 citations

Engineering, Materials Engineering, Electronic Materials +16