Statistics
Publications
1
Citations
25
H-Index
1
Active since
2009
Affiliations
Maxim Integrated (United States)(Current)
Mahdi Rahim is an author at Maxim Integrated (United States) specializing in package reliability, package characterization, and package design.
Publications per year
2009–2009
1
1
Board level temperature cycling study of large array Wafer Level Package
Mahdi Rahim, Tiao Zhou, Xuejun Fan et al. · 2009 · 25 citations
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