Xin Sun

Numerical modeling and experimental verification of through silicon via (TSV) filling in presence of additives

Yunhui Zhu, Shenglin Ma, Xin Sun et al. · Microelectronic Engineering · 2013 · 37 citations

Engineering, Materials Engineering, Materials Science +17

Measurement-based electrical characterization of through silicon vias and transmission lines for 3D integration

Xin Sun, Runiu Fang, Yunhui Zhu et al. · Microelectronic Engineering · 2015 · 25 citations

Engineering, Electrical Engineering, Materials Engineering +16

Characteristics of Coupling Capacitance Between Signal-Ground TSVs Considering MOS Effect in Silicon Interposers

Runiu Fang, Xin Sun, Min Miao et al. · IEEE Transactions on Electron Devices · 2015 · 24 citations

Engineering, Computer Engineering, Electrical Engineering +17

Research on deep RIE-based through-Si-via micromachining for 3-D system-in-package integration

Min Miao, Yufeng Jin, Hongguang Liao et al. · 2009 · 15 citations

Engineering, Electrical Engineering, Microfabrication +16

Bottom-up filling of Through Silicon Via (TSV) with Parylene as sidewall protection layer

Min Miao, Yunhui Zhu, Ming Ji et al. · 2009 · 15 citations

Engineering, Electrical Engineering, Materials Science +15