8
Publications
136
Citations
8
H-Index
1997
Active since
Ming Ji is an author at Harbin Institute of Technology specializing in engineering, mechanical engineering, and materials science.
Top concepts
EngineeringMechanical EngineeringMaterial ScienceMaterials Engineering3D PrintingElectronic PackagingElectrical EngineeringApplied PhysicsMicroelectronicsMicrofabrication
Publications per year
1997–2023
8
8
Bottom-up filling of Through Silicon Via (TSV) with Parylene as sidewall protection layer
Min Miao, Yunhui Zhu, Ming Ji et al. · 2009 · 15 citations
Electrical characterization of sidewall insulation layer of TSV
Xin Sun, Ming Ji, Shenglin Ma et al. · 2010 · 14 citations
Engineering, Interconnect (Integrated Circuits), Breakdown Voltage +16
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