Concepedia

Ted Tessier

TT

13

Publications

191

Citations

11

H-Index

1983

Active since

Affiliations

Motorola (United States)(Current)

MCNC Research and Development Institute

Dow Chemical (United States)

Research Triangle Park Foundation

Dow Chemical (India)

Ted Tessier is an author at Motorola (United States) specializing in engineering, materials science, and electronic packaging.

Top concepts

EngineeringMaterial ScienceApplied PhysicsElectronic PackagingMicroelectronicsMicrofabrication3D PrintingMechanical EngineeringAdvanced PackagingLaser Applications

Publications per year

1983–2014

13

Publications

13

Polymer dielectric options for thin film packaging applications

Ted Tessier, G.M. Adema, I. Turlik · Proceedings., 39th Electronic Components Conference · 2003 · 31 citations

Materials Science, Advanced Packaging, Conducting Polymer +14

Compatibility of common MCM-D dielectric with scanning laser ablation via generation processes

Ted Tessier, G. A. Chandler · IEEE Transactions on Components Hybrids and Manufacturing Technology · 1993 · 20 citations

Engineering, Mechanical Engineering, Laser Applications +17

A photosensitive-BCB on laminate technology (MCM-LD)

Andrew Strandjord, R.H. Heistand, J. N. Bremmer et al. · 2002 · 17 citations

Engineering, Multichip Module, Mechanical Engineering +20

High rate magnetron RIE of thick polyimide films for advanced computer packaging applications

G.J. Dishon, Stephen M. Bobbio, Ted Tessier et al. · Journal of Electronic Materials · 1989 · 16 citations

Materials Science, Advanced Packaging, Materials Engineering +8

Benzocyclobutene as a dielectric for multichip module fabrication

M. Berry, Ted Tessier, I. Turlik et al. · 2002 · 16 citations

Materials Science, Electrical Engineering, Miniaturization +13

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