C.H. Yu - Concepedia

Author

C.H. Yu

Also Known As

C.H. Yu, Chung-Hee Yu

Publications

260

Citations

H-Index

Concepts

All Affiliations

C.H. Yu is an author at Electronics and Telecommunications Research Institute specializing in engineering, materials science, and microstructure.

#	Concept	H-Index	Publications	Citations
1	Engineering	6	6	236
2	Materials Science	5	5	224
3	Materials Engineering	3	3	129
4	Applied Physics	2	2	87
5	Mechanical Engineering	1	1	12

C.H. Yu

Publications

236

Citations

H-Index

Page 1

	Year	Citations
Tin whisker formation of lead-free plated leadframes K.S. Kim, C.H. Yu, Jun‐Mo Yang Microelectronics Reliability Materials ScienceEngineeringPowder MetallurgyCorrosionTin Whisker Formation	2006	48
Investigation of relation between intermetallic and tin whisker growths under ambient condition K.S. Kim, C.H. Yu, S.W. Han, Microelectronics Reliability Materials ScienceMaterials EngineeringEngineeringApplied PhysicsAmbient Condition	2007	47
Behavior of tin whisker formation and growth on lead-free solder finish Kyung-Seob Kim, C.H. Yu, Jun‐Mo Yang Thin Solid Films Materials ScienceEngineeringPowder MetallurgyCorrosionLead-free Solder Finish	2005	47
Isothermal aging characteristics of Sn–Pb micro solder bumps K. S. Kim, C.H. Yu, Nam‐Hoon Kim, Microelectronics Reliability Materials EngineeringMaterials ScienceEngineeringSolder BumpsElectronic Packaging	2003	42
The formation and growth of intermetallic compounds and shear strength at Sn–Zn solder/Au–Ni–Cu interfaces K.S. Kim, Kang-Mook Ryu, C.H. Yu, Microelectronics Reliability Materials EngineeringMaterials ScienceIntermetallic CompoundsEngineeringApplied Physics	2004	40
Aging treatment characteristics of solder bump joint for high reliability optical module Kyung-Seob Kim, C.H. Yu, Jun-Mo Yang Thin Solid Films Solder Bump JointEngineeringHardware ReliabilityMechanical EngineeringElectronic Packaging	2004	12

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