Publication | Closed Access
The formation and growth of intermetallic compounds and shear strength at Sn–Zn solder/Au–Ni–Cu interfaces
40
Citations
9
References
2004
Year
Materials EngineeringMaterials ScienceIntermetallic CompoundsEngineeringApplied PhysicsInterfacial PhenomenaShear StrengthAlloy PhaseSn–zn Solder/au–ni–cu InterfacesInterface PropertyMicrostructure
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