Concepedia

Publication | Closed Access

Isothermal aging characteristics of Sn–Pb micro solder bumps

DOI

42

Citations

6

References

2003

Year

K. S. Kim, C.H. Yu, Nam‐Hoon Kim, N. K. Kim, Ho Chang, Eui-Goo Chang
Microelectronics Reliability

References

YearCitations

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