Eui-Goo Chang

Isothermal aging characteristics of Sn–Pb micro solder bumps

K. S. Kim, C.H. Yu, Nam‐Hoon Kim et al. · Microelectronics Reliability · 2003 · 42 citations

Materials Engineering, Materials Science, Engineering +3

Design of experiment (DOE) method considering interaction effect of process parameters for optimization of copper chemical mechanical polishing (CMP) process

Nam‐Hoon Kim, Min-Ho Choi, Sang-Yong Kim et al. · Microelectronic Engineering · 2005 · 35 citations

Materials Science, Industrial Design, Chemical Engineering +12

Effects of phosphoric acid stabilizer on copper and tantalum nitride CMP

Nam‐Hoon Kim, Jong-Heun Lim, Sang-Yong Kim et al. · Materials Letters · 2003 · 29 citations

Materials Science, Inorganic Chemistry, Engineering +4

Damage in etching of (Ba, Sr)TiO3 thin films using inductively coupled plasma

Sung-Ki Choi, Dong‐Pyo Kim, Chang-Il Kim et al. · Journal of Vacuum Science & Technology A Vacuum Surfaces and Films · 2001 · 24 citations

Materials Engineering, Materials Science, Chemical Engineering +13

Study on surface reaction of (Ba, Sr)TiO3 thin films by high density plasma etching

Seung-Bum Kim, Chang-Il Kim, Eui-Goo Chang et al. · Journal of Vacuum Science & Technology A Vacuum Surfaces and Films · 1999 · 22 citations

Materials Engineering, Materials Science, Electrical Engineering +15