Hans‐Jürgen Engelmann

Characterization of barrier/seed layer stacks of Cu interconnects by electron tomographic three-dimensional object reconstruction

Heiko Stegmann, Hans‐Jürgen Engelmann, Ehrenfried Zschech · Microelectronic Engineering · 2002 · 26 citations

Natural Sciences, Materials Engineering, Materials Science +16

Interface Formation in the US-Wedge/Wedge-Bond Process of AlSi1/CuNiAu Contacts

Jürgen Funck, Martin Schneider‐Ramelow, Hans‐Jürgen Engelmann et al. · Journal of Electronic Materials · 2010 · 25 citations

Natural Sciences, Materials Engineering, Materials Science +15

Site-controlled formation of single Si nanocrystals in a buried SiO₂ matrix using ion beam mixing

Xiaomo Xu, Thomas Prüfer, Daniel Wolf et al. · Beilstein Journal of Nanotechnology · 2018 · 15 citations · Full text

Natural Sciences, Materials Science, Physics +17

The application of low energy ion scattering spectroscopy (LEIS) in sub 28‐nm CMOS technology

Kornelia Dittmar, Dina H. Triyoso, Elke Erben et al. · Surface and Interface Analysis · 2017 · 12 citations

Natural Sciences, Materials Engineering, Materials Science +17

Morphology modification of Si nanopillars under ion irradiation at elevated temperatures: plastic deformation and controlled thinning to 10 nm

Xiaomo Xu, K.‐H. Heinig, W. Möller et al. · Semiconductor Science and Technology · 2019 · 11 citations · Full text

Engineering, Materials Engineering, Materials Science +17